Re: hardware texturing broken on Octane HELP

From: Greg Douglas (gdouglas_at_reputable.com)
Date: 02/26/04

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    Date: Wed, 25 Feb 2004 22:24:18 -0700
    
    

    Andreas Backhaus wrote:

    > the pins of the RAMs desolder because of the heat - you just have to
    > check the four TRAMs on each module for those desoldered pins. That's
    > about it ;)

    I seriously doubt that the TRAMs get to around 400 degrees F. (204.4
    degrees C), which is the temperature that 60/40 tin/lead solder
    melts. I've never seen any semiconductor device boil spit
    (100 deg. C) and survive more than a few minutes.

    More likely they weren't IR reflowed properly during production. When
    fresh, the resin in the solder paste allows the solder paste to make a
    connection. But as the resin dries out over time (and high temps),
    it loses the electrical connection.

    BTW, I have seen this (loose pins) on TRAMs, I use a stereo microscope,
    and press down on each pin of the RAM ICs with the tip of an Xacto
    knife. If the IC lead moves at all, it's not soldered. It IS a
    bit of an art (and requires much practice), but it can be soldered.
    Use a very fine tip soldering iron, at around 600-650 deg. F, and
    very fine solder, or solder paste if you can find it.

    --
    Greg Douglas
    Reputable Systems
    

  • Next message: Michael Renner: "Re: boot into single mode?"

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